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2428 motorola smallsignal transistors, fets and diodes device data
npn silicon maximum ratings rating symbol MMPQ2222 MMPQ2222a unit collector emitter voltage v ceo 30 40 vdc collector base voltage v cb 60 75 vdc emitter base voltage v eb 5.0 vdc collector current e continuous i c 500 madc each transistor four transistors equal power total power dissipation @ t a = 25 c derate above 25 c p d 0.52 4.2 1.0 8.0 watts mw/ c total power dissipation @ t c = 25 c derate above 25 c p d 0.8 6.4 2.4 19.2 watts mw/ c operating and storage junction temperature range t j , t stg 55 to +150 c electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min typ max unit off characteristics collector emitter breakdown voltage (1) MMPQ2222 (i c = 10 madc, i b = 0) MMPQ2222a v (br)ceo 30 40 e e e e vdc collector base breakdown voltage MMPQ2222 (i c = 10 adc, i e = 0) MMPQ2222a v (br)cbo 60 75 e e e e vdc emitter base breakdown voltage (i b = 10 adc, i c = 0) v (br)ebo 5.0 e e e e e vdc collector cutoff current (v cb = 50 vdc, i e = 0) MMPQ2222 (v cb = 60 vdc, i e = 0) MMPQ2222a i cbo e e e e 50 10 nadc emitter cutoff current (v eb = 3.0 vdc, i c = 0) i ebo e e 100 nadc 1. pulse test: pulse width 300 s; duty cycle 2.0%. preferred devices are motorola recommended choices for future use and best overall value. semiconductor technical data

*motorola preferred device case 751b05, style 4 so16 1 16 1 2 3 4 5 6 7 8 10 11 12 13 14 15 16 9 rev 1
2429 motorola smallsignal transistors, fets and diodes device data electrical characteristics (t a = 25 c unless otherwise noted) (continued) characteristic symbol min typ max unit on characteristics dc current gain (1) (i c = 100 a, v ce = 10 v) MMPQ2222a (i c = 1.0 ma, v ce = 10 v) MMPQ2222a (i c = 10 ma, v ce = 10 v) MMPQ2222 MMPQ2222a (i c = 150 ma, v ce = 10 v) MMPQ2222 MMPQ2222a (i c = 300 ma, v ce = 10 v) MMPQ2222 (i c = 500 ma, v ce = 10 v) MMPQ2222a (i c = 150 ma, v ce = 1.0 v) MMPQ2222a h fe 35 50 75 75 100 100 30 40 50 e e e e e e e e e e e e e e 300 e e e e collector emitter saturation voltage (1) (i c = 150 madc, i b = 15 madc) MMPQ2222 MMPQ2222a (i c = 300 madc, i b = 30 madc) MMPQ2222 (i c = 500 madc, i b = 50 madc) MMPQ2222a v ce(sat) e e e e e e e e 0.4 0.3 1.6 1.0 vdc base emitter saturation voltage (1) (i c = 150 madc, i b = 15 madc) MMPQ2222 MMPQ2222a (i c = 300 madc, i b = 30 madc) MMPQ2222 (i c = 500 madc, i b = 50 madc) MMPQ2222a v be(sat) e e e e e e e e 1.3 1.2 2.6 2.0 vdc dynamic characteristics current gain e bandwidth product (1) (i c = 20 madc, v ce = 20 vdc, f = 100 mhz) f t 200 350 e mhz output capacitance (v cb = 10 vdc, i e = 0, f = 1.0 mhz) c ob e 4.5 e pf input capacitance (v eb = 0.5 vdc, i c = 0, f = 1.0 mhz) c ib e 17 e pf switching characteristics turnon time (v cc = 30 vdc, v be(off) = 0.5 vdc, i c = 150 madc, i b1 = 15 madc) t on e 25 e ns turnoff time (v cc = 30 vdc, i c = 150 madc, i b1 = i b2 = 15 madc) t off e 250 e ns 1. pulse test: pulse width 300 s; duty cycle 2.0%.
22 motorola smallsignal transistors, fets and diodes device data embossed tape and reel sot-23, sc-59, sc-70/sot-323, sc90/sot416, sot-223 and so-16 packages are available only in tape and reel. use the appropriate suffix indicated below to order any of the sot-23, sc-59, sc-70/sot-323, sot-223 and so-16 packages. (see section 6 on packaging for additional information). sot-23: available in 8 mm tape and reel use the device title (which already includes the at1o suffix) to order the 7 inch/3000 unit reel. replace the at1o suffix in the device title with a at3o suffix to order the 13 inch/10,000 unit reel. sc-59: available in 8 mm tape and reel use the device title (which already includes the at1o suffix) to order the 7 inch/3000 unit reel. replace the at1o suffix in the device title with a at3o suffix to order the 13 inch/10,000 unit reel. sc-70/ available in 8 mm tape and reel sot-323: use the device title (which already includes the at1o suffix) to order the 7 inch/3000 unit reel. replace the at1o suffix in the device title with a at3o suffix to order the 13 inch/10,000 unit reel. sot-223: available in 12 mm tape and reel use the device title (which already includes the at1o suffix) to order the 7 inch/1000 unit reel. replace the at1o suffix in the device title with a at3o suffix to order the 13 inch/4000 unit reel. so-16: available in 16 mm tape and reel add an ar1o suffix to the device title to order the 7 inch/500 unit reel. add an ar2o suffix to the device title to order the 13 inch/2500 unit reel. radial tape in fan fold box or reel to-92 packages are available in both bulk shipments and in radial tape in fan fold boxes or reels. fan fold boxes and radial tape reel are the best methods for capturing devices for automatic insertion in printed circuit boards. to-92: available in fan fold box add an arlro suffix and the appropriate style code* to the device title to order the fan fold box. available in 365 mm radial tape reel add an arlro suffix and the appropriate style code* to the device title to order the radial tape reel. *refer to section 6 on packaging for style code characters and additional information on ordering * requirements. device markings/date code characters sot-23, sc-59, sc-70/sot-323, and the sc90/sot416 packages have a device marking and a date code etched on the device. the generic example below depicts both the device marking and a representa- tion of the date code that appears on the sc-70/sot-323, sc-59 and sot-23 packages. abc d the ado represents a smaller alpha digit date code. the date code indicates the actual month in which the part was manufactured.
tape and reel specifications 62 motorola smallsignal transistors, fets and diodes device data tape and reel specifications and packaging specifications embossed tape and reel is used to facilitate automatic pick and place equipment feed requirements. the tape is used as the shipping container for various products and requires a minimum of handling. the antistatic/conductive tape provides a secure cavity for the product when sealed with the apeelbacko cover tape. w two reel sizes available (7 , and 13 , ) w used for automatic pick and place feed systems w minimizes product handling w eia 481, 1, 2 w sod123, sc59, sc70/sot323, sc70ml/sot363, sot23, tsop6, in 8 mm tape w sot223 in 12 mm tape w so14, so16 in 16 mm tape use the standard device title and add the required suffix as listed in the option table on the following page. note that the in dividual reels have a finite number of devices depending on the type of product contained in the tape. also note the minimum lot size is one full reel for each line item, and orders are required to be in increments of the single reel quantity. of feed direction sc59, sc70/sot323, sot23 8 mm 8 mm 12 mm sot223 sod123 16 mm so14, 16 sc70ml/sot363, tsop6 t1 orientation 8 mm sc70ml/sot363 t2 orientation 8 mm embossed tape and reel ordering information package tape width (mm) pitch mm (inch) reel size mm (inch) devices per reel and minimum order quantity device suffix sc59 8 4.0 + 0.1 (.157 + .004) 178 (7) 3,000 t1 sc70/sot323 8 4.0 + 0.1 (.157 + .004) 178 (7) 3,000 t1 8 330 (13) 10,000 t3 so14 16 8.0 + 0.1 (.315 + .004) 178 (7) 500 r1 16 330 (13) 2,500 r2 so16 16 8.0 + 0.1 (.315 + .004) 178 (7) 500 r1 16 330 (13) 2,500 r2 sod123 8 4.0 + 0.1 (.157 + .004) 178 (7) 3,000 t1 8 330 (13) 10,000 t3 sot23 8 4.0 + 0.1 (.157 + .004) 178 (7) 3,000 t1 8 330 (13) 10,000 t3 sot223 12 8.0 + 0.1 (.315 + .004) 178 (7) 1,000 t1 12 330 (13) 4,000 t3 sc70ml/sot363 8 4.0 + 0.1 (.157 + .004) 178 (7) 3,000 t1 8 178 (7) 3,000 t2 tsop6 8 4.0 + 0.1 (.157 + .004) 178 (7) 3,000 t1
63 tape and reel specifications motorola smallsignal transistors, fets and diodes device data embossed tape and reel data for discretes carrier tape specifications p 0 k t b 1 k 0 top cover tape embossment user direction of feed center lines of cavity d p 2 10 pitches cumulative tolerance on tape + 0.2 mm ( + 0.008 , ) e f w p b 0 a 0 d 1 for components 2.0 mm x 1.2 mm and larger * top cover tape thickness (t 1 ) 0.10 mm (.004 , ) max. embossment embossed carrier r min bending radius maximum component rotation typical component cavity center line typical component center line 100 mm (3.937 , ) 250 mm (9.843 , ) 1 mm (.039 , ) max 1 mm max 10 5 tape and components shall pass around radius aro without damage tape for machine reference only including draft and radii concentric around b 0 camber (top view) allowable camber to be 1 mm/100 mm nonaccumulative over 250 mm see note 1 bar code label dimensions tape size b 1 max d d 1 e f k p 0 p 2 r min t max w max 8mm 4.55 mm (.179 , ) 1 .5 +0 . 1mm 0.0 ( 0 9 + 004 1.0 min (.039 , ) 1 . 7 5 + 0 . 1mm (.069 + .004 , ) 3.5 + 0.05 mm (.138 + .002 , ) 2.4 mm max (.094 , ) 4 . 0 + 0 . 1mm (.157 + .004 , ) 2 . 0 + 0 . 1mm (.079 + .002 , ) 25 mm (.98 , ) 0 . 6mm (.024 , ) 8.3 mm (.327 , ) 12 mm 8.2 mm (.323 , ) ( . 0 5 9+ . 004 , 0.0) 1 .5 mm mi n (.060 , ) 5.5 + 0.05 mm (.217 + .002 , ) 6.4 mm max (.252 , ) 30 mm (1.18 , ) 12 + .30 mm (.470 + .012 , ) 16 mm 12.1 mm (.476 , ) 7.5 + 0.10 mm (.295 + .004 , ) 7.9 mm max (.311 , ) 16.3 mm (.642 , ) 24 mm 20.1 mm (.791 , ) 11.5 + 0.1 mm (.453 + .004 , ) 11.9 mm max (.468 , ) 24.3 mm (.957 , ) metric dimensions govern e english are in parentheses for reference only. note 1: a 0 , b 0 , and k 0 are determined by component size. the clearance between the components and the cavity must be within .05 mm min. to .50 mm max ., note 1: the component cannot rotate more than 10 5 within the determined cavity. note 2: if b 1 exceeds 4.2 mm (.165) for 8 mm embossed tape, the tape may not feed through all tape feeders. note 3: pitch information is contained in the embossed tape and reel ordering information on pg. 5.123.
tape and reel specifications 64 motorola smallsignal transistors, fets and diodes device data embossed tape and reel data for discretes a full radius t max g 20.2 mm min (.795 , ) 1.5 mm min (.06 , ) 13.0 mm + 0.5 mm (.512 , + .002 , ) 50 mm min (1.969 , ) outside dimension measured at edge inside dimension measured near hub size a max g t max 8 mm 330 mm (12.992 , ) 8.4 mm + 1.5 mm, 0.0 (.33 , + .059 , , 0.00) 14.4 mm (.56 , ) 12 mm 330 mm (12.992 , ) 12.4 mm + 2.0 mm, 0.0 (.49 , + .079 , , 0.00) 18.4 mm (.72 , ) 16 mm 360 mm (14.173 , ) 16.4 mm + 2.0 mm, 0.0 (.646 , + .078 , , 0.00) 22.4 mm (.882 , ) 24 mm 360 mm (14.173 , ) 24.4 mm + 2.0 mm, 0.0 (.961 , + .070 , , 0.00) 30.4 mm (1.197 , ) reel dimensions metric dimensions govern e english are in parentheses for reference only
65 packaging specifications motorola smallsignal transistors, fets and diodes device data to92 eia, iec, eiaj radial tape in fan fold box or on reel radial tape in fan fold box or on reel of the reliable to92 package are the best methods of capturing devices for automatic insertion in printed circuit boards. these methods of taping are compatible with various equipment for active and passive component insertion. w available in fan fold box w available on 365 mm reels w accommodates all standard inserters w allows flexible circuit board layout w 2.5 mm pin spacing for soldering w eia468, iec 2862, eiaj rc1008b ordering notes: when ordering radial tape in fan fold box or on reel, specify the style per figures 3 through 8. add the suffix arlro and astyleo to the device title, i.e. mps3904rlra. this will be a standard mps3904 radial taped and supplied on a reel per figure 9. fan fold box information e order in increments of 2000. reel information e order in increments of 2000. us/european suffix conversions us europe rlra rl rlre rl1 rlrm zl1 to92 radial tape in fan fold box or on reel
packaging specifications 66 motorola smallsignal transistors, fets and diodes device data to92 eia radial tape in fan fold box or on reel h2a h2a h f1 f2 p2 p2 p1 p d w w1 l1 w2 h2b h2b t1 t t2 h4 h5 h1 figure 1. device positioning on tape l specification inches millimeter symbol item min max min max d tape feedhole diameter 0.1496 0.1653 3.8 4.2 d2 component lead thickness dimension 0.015 0.020 0.38 0.51 f1, f2 component lead pitch 0.0945 0.110 2.4 2.8 h bottom of component to seating plane .059 .156 1.5 4.0 h1 feedhole location 0.3346 0.3741 8.5 9.5 h2a deflection left or right 0 0.039 0 1.0 h2b deflection front or rear 0 0.051 0 1.0 h4 feedhole to bottom of component 0.7086 0.768 18 19.5 h5 feedhole to seating plane 0.610 0.649 15.5 16.5 l defective unit clipped dimension 0.3346 0.433 8.5 11 l1 lead wire enclosure 0.09842 e 2.5 e p feedhole pitch 0.4921 0.5079 12.5 12.9 p1 feedhole center to center lead 0.2342 0.2658 5.95 6.75 p2 first lead spacing dimension 0.1397 0.1556 3.55 3.95 t adhesive tape thickness 0.06 0.08 0.15 0.20 t1 overall taped package thickness e 0.0567 e 1.44 t2 carrier strip thickness 0.014 0.027 0.35 0.65 w carrier strip width 0.6889 0.7481 17.5 19 w1 adhesive tape width 0.2165 0.2841 5.5 6.3 w2 adhesive tape position .0059 0.01968 .15 0.5 notes: 1. maximum alignment deviation between leads not to be greater than 0.2 mm. 2. defective components shall be clipped from the carrier tape such that the remaining protrusion (l) does not exceed a maximum of 11 mm. 3. component lead to tape adhesion must meet the pull test requirements established in figures 5, 6 and 7. 4. maximum noncumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. 5. holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. 6. no more than 1 consecutive missing component is permitted. 7. a tape trailer and leader, having at least three feed holes is required before the first and after the last component. 8. splices will not interfere with the sprocket feed holes.
67 packaging specifications motorola smallsignal transistors, fets and diodes device data to92 eia radial tape in fan fold box or on reel ??????? ??????? ??????? ??????? adhesive tape on top side flat side carrier strip flat side of transistor and adhesive tape visible. adhesive tape on top side rounded side carrier strip rounded side of transistor and adhesive tape visible. 252 mm 9.92o 58 mm 2.28o max max 13o max 330 mm style m fan fold box is equivalent to styles e and f of reel pack dependent on feed orientation from box. style p fan fold box is equivalent to styles a and b of reel pack dependent on feed orientation from box. 100 gram pull force 16 mm holding fixture holding fixture holding fixture 16 mm 70 gram pull force 500 gram pull force the component shall not pull free with a 300 gram load applied to the leads for 3 + 1 second. the component shall not pull free with a 70 gram load applied to the leads for 3 + 1 second. there shall be no deviation in the leads and no component leads shall be pulled free of the tape with a 500 gram load applied to the component body for 3 + 1 second. figure 2. style m figure 3. style p figure 4. fan fold box dimensions figure 5. test #1 figure 6. test #2 figure 7. test #3 adhesion pull tests fan fold box styles
packaging specifications 68 motorola smallsignal transistors, fets and diodes device data to92 eia radial tape in fan fold box or on reel reel styles arbor hole dia. 30.5mm + 0.25mm marking note recess depth 9.5mm min 48 mm max core dia. 82mm + 1mm hub recess 76.2mm + 1mm 365mm + 3, 0mm 38.1mm + 1mm material used must not cause deterioration of components or degrade lead solderability carrier strip adhesive tape rounded side feed rounded side of transistor and adhesive tape visible. adhesive tape on reverse side carrier strip flat side feed flat side of transistor and carrier strip visible (adhesive tape on reverse side). carrier strip adhesive tape flat side feed flat side of transistor and adhesive tape visible. rounded side of transistor and carrier strip visible (adhesive tape on reverse side). feed adhesive tape on reverse side carrier strip rounded side figure 8. reel specifications figure 9. style a figure 10. style b figure 11. style e figure 12. style f
surface mount information 710 motorola smallsignal transistors, fets and diodes device data information for using surface mount packages recommended footprints for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the semiconductor packages must be the correct size to ensure proper solder connection inter- face between the board and the package. with the correct pad geometry, the packages will self align when subjected to a solder reflow process. power dissipation for a surface mount device the power dissipation for a surface mount device is a func- tion of the drain/collector pad size. these can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. power dissipation for a surface mount device is determined by t j(max) , the maximum rated junction temperature of the die, r q ja , the thermal resistance from the device junction to ambient, and the operating temperature, t a . using the values provided on the data sheet, p d can be calculated as follows: p d = t j(max) t a r q ja the values for the equation are found in the maximum ratings table on the data sheet. substituting these values into the equation for an ambient temperature t a of 25 c, one can calculate the power dissipation of the device. for example, for a sot223 device, p d is calculated as follows. p d = 150 c 25 c 156 c/w = 800 milliwatts the 156 c/w for the sot223 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 800 milliwatts. there are other alternatives to achieving higher power dissipation from the surface mount packages. one is to increase the area of the drain/collector pad. by increasing the area of the drain/collector pad, the power dissipation can be increased. although the power dissipation can almost be doubled with this method, area is taken up on the printed circuit board which can defeat the purpose of using surface mount technology. for example, a graph of r q ja versus drain pad area is shown in figure 1. another alternative would be to use a ceramic substrate or an aluminum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. to ambient ( c/w) r ja , thermal re s i s tance , j u ncti o n q 0.8 watts 1.25 watts* 1.5 watts a, area (square inches) 0.0 0.2 0.4 0.6 0.8 1.0 160 140 120 100 80 board material = 0.0625 g10/fr4, 2 oz copper t a = 25 c *mounted on the dpak footprint figure 1. thermal resistance versus drain pad area for the sot223 package (typical) solder stencil guidelines prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. solder stencils are used to screen the optimum amount. these stencils are typically 0.008 inches thick and may be made of brass or stainless steel. for packages such as the sot23, sc59, sc70/sot323, sc90/sot416, sod123, sot223, sot363, so14, so16, and tsop6 packages, the stencil opening should be the same as the pad size or a 1:1 registration.
711 surface mount information motorola smallsignal transistors, fets and diodes device data soldering precautions the melting temperature of solder is higher than the rated temperature of the device. when the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. therefore, the following items should always be observed in order to mini- mize the thermal stress to which the devices are subjected. ? always preheat the device. ? the delta temperature between the preheat and soldering should be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, the difference should be a maximum of 10 c. ? the soldering temperature and time should not exceed 260 c for more than 10 seconds. ? when shifting from preheating to soldering, the maximum temperature gradient shall be 5 c or less. ? after soldering has been completed, the device should be allowed to cool naturally for at least three minutes. gradual cooling should be used since the use of forced cooling will increase the temperature gradient and will result in latent failure due to mechanical stress. ? mechanical stress or shock should not be applied during cooling. * soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. typical solder heating profile for any given circuit board, there will be a group of control settings that will give the desired heat pattern. the operator must set temperatures for several heating zones and a figure for belt speed. taken together, these control settings make up a heating aprofileo for that particular circuit board. on machines controlled by a computer, the computer remem- bers these profiles from one operating session to the next. figure 2 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. this profile will vary among soldering systems, but it is a good starting point. factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. this profile shows temperature versus time. the line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. the two profiles are based on a high density and a low density board. the vitronics smd310 convection/infrared reflow soldering system was used to generate this profile. the type of solder used was 62/36/2 tin lead silver with a melting point between 177 189 c. when this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. the components on the board are then heated by conduction. the circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. step 1 preheat zone 1 arampo step 2 vent asoako step 3 heating zones 2 & 5 arampo step 4 heating zones 3 & 6 asoako step 5 heating zones 4 & 7 aspikeo step 6 vent step 7 cooling 200 c 150 c 100 c 50 c time (3 to 7 minutes total) t max solder is liquid for 40 to 80 seconds (depending on mass of assembly) 205 to 219 c peak at solder joint desired curve for low mass assemblies 100 c 150 c 160 c 170 c 140 c figure 2. typical solder heating profile desired curve for high mass assemblies
surface mount information 712 motorola smallsignal transistors, fets and diodes device data footprints for soldering 0.094 2.4 sc59 mm inches 0.037 0.95 0.037 0.95 0.039 1.0 0.031 0.8 sot23 mm inches 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 so14, so16 mm inches 0.060 1.52 0.275 7.0 0.024 0.6 0.050 1.270 0.155 4.0 sot223 0.079 2.0 0.15 3.8 0.248 6.3 0.079 2.0 0.059 1.5 0.059 1.5 0.059 1.5 0.091 2.3 0.091 2.3 mm inches mm inches 0.035 0.9 0.075 0.7 1.9 0.028 0.65 0.025 0.65 0.025 sc70/sot323 1.4 1 0.5 min. (3x) 0.5 min. (3x) 0.5 sot 416/sc90
713 surface mount information motorola smallsignal transistors, fets and diodes device data sot363 (sc70 6 lead) 0.5 mm (min) 0.4 mm (min) 0.65 mm 0.65 mm 1.9 mm sod123 mm inches 0.91 0.036 1.22 0.048 2.36 0.093 4.19 0.165 inches mm 0.028 0.7 0.074 1.9 0.037 0.95 0.037 0.95 0.094 2.4 0.039 1.0 tsop6
package outline dimensions 82 motorola smallsignal transistors, fets and diodes device data package outline dimensions dimensions are in inches unless otherwise noted. notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. contour of package beyond dimension r is uncontrolled. 4. dimension f applies between p and l. dimension d and j apply between l and k minimum. lead dimension is uncontrolled in p and beyond dimension k minimum. r a p j l f b k g h section xx c v d n n xx seating plane dim min max min max millimeters inches a 0.175 0.205 4.45 5.20 b 0.170 0.210 4.32 5.33 c 0.125 0.165 3.18 4.19 d 0.016 0.022 0.41 0.55 f 0.016 0.019 0.41 0.48 g 0.045 0.055 1.15 1.39 h 0.095 0.105 2.42 2.66 j 0.015 0.020 0.39 0.50 k 0.500 12.70 l 0.250 6.35 n 0.080 0.105 2.04 2.66 p 0.100 2.54 r 0.115 2.93 v 0.135 3.43 1 case 02904 (to226aa) to92 plastic style 21: pin 1. collector 2. emitter 3. base style 22: pin 1. source 2. gate 3. drain style 14: pin 1. emitter 2. collector 3. base style 30: pin 1. drain 2. gate 3. source style 1: pin 1. emitter 2. base 3. collector style 2: pin 1. base 2. emitter 3. collector style 3: pin 1. anode 2. anode 3. cathode style 5: pin 1. drain 2. source 3. gate style 7: pin 1. source 2. drain 3. gate style 15: pin 1. anode 1 2. cathode 3. anode 2 style 17: pin 1. collector 2. base 3. emitter style 4: pin 1. cathode 2. cathode 3. anode notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. contour of package beyond dimension r is uncontrolled. 4. dimension f applies between p and l. dimensions d and j apply between l and k mimimum. lead dimension is uncontrolled in p and beyond dimension k minimum. r a p l f b k g h c v n n xx seating plane 1 j section xx d dim min max min max millimeters inches a 0.175 0.205 4.44 5.21 b 0.290 0.310 7.37 7.87 c 0.125 0.165 3.18 4.19 d 0.018 0.022 0.46 0.56 f 0.016 0.019 0.41 0.48 g 0.045 0.055 1.15 1.39 h 0.095 0.105 2.42 2.66 j 0.018 0.024 0.46 0.61 k 0.500 12.70 l 0.250 6.35 n 0.080 0.105 2.04 2.66 p 0.100 2.54 r 0.135 3.43 v 0.135 3.43 23 case 02905 (to226ae) to92 1watt plastic style 1: pin 1. emitter 2. base 3. collector style 14: pin 1. emitter 2. collector 3. base style 22: pin 1. source 2. gate 3. drain
83 package outline dimensions motorola smallsignal transistors, fets and diodes device data package outline dimensions (continued) notes: 1. package contour optional within dia b and length a. heat slugs, if any, shall be included within this cylinder, but shall not be subject to the min limit of dia b. 2. lead dia not controlled in zones f, to allow for flash, lead finish buildup, and minor irregularities other than heat slugs. case 5102 (do204aa) do7 dim min max min max inches millimeters a 5.84 7.62 0.230 0.300 b 2.16 2.72 0.085 0.107 d 0.46 0.56 0.018 0.022 f 1.27 0.050 k 25.40 38.10 1.000 1.500 all jedec dimensions and notes apply. k a d b f k f notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. contour of package beyond zone r is uncontrolled. 4. dimension f applies between p and l. dimensions d and j apply between l and k minimum. lead dimension is uncontrolled in p and beyond dim k minimum. case 18202 plastic (t0226ac) to92 a l k b r f p d h g xx seating plane 12 v n c n section xx d j dim min max min max millimeters inches a 0.175 0.205 4.45 5.21 b 0.170 0.210 4.32 5.33 c 0.125 0.165 3.18 4.49 d 0.016 0.022 0.41 0.56 f 0.016 0.019 0.407 0.482 g 0.050 bsc 1.27 bsc h 0.100 bsc 3.54 bsc j 0.014 0.016 0.36 0.41 k 0.500 12.70 l 0.250 6.35 n 0.080 0.105 2.03 2.66 p 0.050 1.27 r 0.115 2.93 v 0.135 3.43 style 1: pin 1. anode 2. cathode
package outline dimensions 84 motorola smallsignal transistors, fets and diodes device data package outline dimensions (continued) case 31808 (to236ab) sot23 d j k l a c b s h g v 3 1 2 dim a min max min max millimeters 0.1102 0.1197 2.80 3.04 inches b 0.0472 0.0551 1.20 1.40 c 0.0350 0.0440 0.89 1.11 d 0.0150 0.0200 0.37 0.50 g 0.0701 0.0807 1.78 2.04 h 0.0005 0.0040 0.013 0.100 j 0.0034 0.0070 0.085 0.177 k 0.0140 0.0285 0.35 0.69 l 0.0350 0.0401 0.89 1.02 s 0.0830 0.1039 2.10 2.64 v 0.0177 0.0236 0.45 0.60 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maxiumum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. style 6: pin 1. base 2. emitter 3. collector style 8: pin 1. anode 2. no connection 3. cathode style 9: pin 1. anode 2. anode 3. cathode style 10: pin 1. drain 2. source 3. gate style 11: pin 1. anode 2. cathode 3. cathodeanode style 12: pin 1. cathode 2. cathode 3. anode style 18: pin 1. no connection 2. cathode 3. anode style 19: pin 1. cathode 2. anode 3. cathodeanode style 21: pin 1. gate 2. source 3. drain plastic s g h d c b l a 1 3 2 j k dim a min max min max inches 2.70 3.10 0.1063 0.1220 millimeters b 1.30 1.70 0.0512 0.0669 c 1.00 1.30 0.0394 0.0511 d 0.35 0.50 0.0138 0.0196 g 1.70 2.10 0.0670 0.0826 h 0.013 0.100 0.0005 0.0040 j 0.09 0.18 0.0034 0.0070 k 0.20 0.60 0.0079 0.0236 l 1.25 1.65 0.0493 0.0649 s 2.50 3.00 0.0985 0.1181 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. case 318d04 sc59 style 3: pin 1. anode 2. anode 3. cathode style 1: pin 1. emitter 2. base 3. collector style 2: pin 1. n.c. 2. anode 3. cathode style 4: pin 1. n.c. 2. cathode 3. anode style 5: pin 1. cathode 2. cathode 3. anode
85 package outline dimensions motorola smallsignal transistors, fets and diodes device data package outline dimensions (continued) h s f a b d g l 4 123 0.08 (0003) c m k j dim a min max min max millimeters 0.249 0.263 6.30 6.70 inches b 0.130 0.145 3.30 3.70 c 0.060 0.068 1.50 1.75 d 0.024 0.035 0.60 0.89 f 0.115 0.126 2.90 3.20 g 0.087 0.094 2.20 2.40 h 0.0008 0.0040 0.020 0.100 j 0.009 0.014 0.24 0.35 k 0.060 0.078 1.50 2.00 l 0.033 0.041 0.85 1.05 m 0 10 0 10 s 0.264 0.287 6.70 7.30 notes: 3. dimensioning and tolerancing per ansi y14.5m, 1982. 4. controlling dimension: inch. case 318e04 sot223 style 1: pin 1. base 2. collector 3. emitter 4. collector style 3: pin 1. gate 2. drain 3. source 4. drain style 2: pin 1. anode 2. cathode 3. nc 4. cathode case 318g02 tsop6 style 1: pin 1. drain 2. drain 3. gate 4. source 5. drain 6. drain 23 4 5 6 a l 1 s g d b h c 0.05 (0.002) dim min max min max inches millimeters a 0.1142 0.1220 2.90 3.10 b 0.0512 0.0669 1.30 1.70 c 0.0354 0.0433 0.90 1.10 d 0.0098 0.0197 0.25 0.50 g 0.0335 0.0413 0.85 1.05 h 0.0005 0.0040 0.013 0.100 j 0.0040 0.0102 0.10 0.26 k 0.0079 0.0236 0.20 0.60 l 0.0493 0.0610 1.25 1.55 m 0 10 0 10 s 0.0985 0.1181 2.50 3.00 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. m j k plastic
package outline dimensions 86 motorola smallsignal transistors, fets and diodes device data package outline dimensions (continued) case 41902 sc70/sot323 c r n a l d g v s b h j k 3 12 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. dim min max min max millimeters inches a 0.071 0.087 1.80 2.20 b 0.045 0.053 1.15 1.35 c 0.035 0.049 0.90 1.25 d 0.012 0.016 0.30 0.40 g 0.047 0.055 1.20 1.40 h 0.000 0.004 0.00 0.10 j 0.004 0.010 0.10 0.25 k 0.017 ref 0.425 ref l 0.026 bsc 0.650 bsc n 0.028 ref 0.700 ref r 0.031 0.039 0.80 1.00 s 0.079 0.087 2.00 2.20 v 0.012 0.016 0.30 0.40 0.05 (0.002) style 3: pin 1. base 2. emitter 3. collector style 4: pin 1. cathode 2. cathode 3. anode style 2: pin 1. anode 2. n.c. 3. cathode style 5: pin 1. anode 2. anode 3. cathode style 7: pin 1. base 2. emitter 3. collector style 9: pin 1. anode 2. cathode 3. cathodeanode style 10: pin 1. cathode 2. anode 3. anodecathode notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h 0.10 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 v 0.30 0.40 0.012 0.016 b 0.2 (0.008) mm 123 a g v s h c n j k 654 b d 6 pl case 419b-01 sot363 style 1: pin 1. emitter 2 2. base 2 3. collector 1 4. emitter 1 5. base 1 6. collector 2 style 6: pin 1. anode 2 2. n/c 3. cathode 1 4. anode 1 5. n/c 6. cathode 2
87 package outline dimensions motorola smallsignal transistors, fets and diodes device data package outline dimensions (continued) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. style 1: pin 1. cathode 2. anode aaa aaa aaa b d k a c e j 1 2 h case 42504 sod123 dim min max min max millimeters inches a 0.055 0.071 1.40 1.80 b 0.100 0.112 2.55 2.85 c 0.037 0.053 0.95 1.35 d 0.020 0.028 0.50 0.70 e 0.004 0.25 h 0.000 0.004 0.00 0.10 j 0.006 0.15 k 0.140 0.152 3.55 3.85 case 46301 sot416/sc90 dim min max min max inches millimeters a 0.70 0.80 0.028 0.031 b 1.40 1.80 0.055 0.071 c 0.60 0.90 0.024 0.035 d 0.15 0.30 0.006 0.012 g 1.00 bsc 0.039 bsc h 0.10 0.004 j 0.10 0.25 0.004 0.010 k 1.45 1.75 0.057 0.069 l 0.10 0.20 0.004 0.008 s 0.50 bsc 0.020 bsc notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. m 0.20 (0.008) b a b s d g 3 pl 0.20 (0.008) a k j l c h 3 2 1 style 1: pin 1. base 2. emitter 3. collector style 4: pin 1. cathode 2. cathode 3. anode
package outline dimensions 88 motorola smallsignal transistors, fets and diodes device data package outline dimensions (continued) notes: 1. leads within 0.13 (0.005) radius of true position at seating plane at maximum material condition. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 4. rounded corners optional. 17 14 8 b a f hg d k c n l j m seating plane dim min max min max millimeters inches a 0.715 0.770 18.16 19.56 b 0.240 0.260 6.10 6.60 c 0.145 0.185 3.69 4.69 d 0.015 0.021 0.38 0.53 f 0.040 0.070 1.02 1.78 g 0.100 bsc 2.54 bsc h 0.052 0.095 1.32 2.41 j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.300 bsc 7.62 bsc m 0 10 0 10 n 0.015 0.039 0.39 1.01 case 64606 14pin dip plastic notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. a b f c s h g d j l m 16 pl seating 18 9 16 k plane t m a m 0.25 (0.010) t dim min max min max millimeters inches a 0.740 0.770 18.80 19.55 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.040 0.70 1.02 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.110 0.130 2.80 3.30 l 0.295 0.305 7.50 7.74 m 0 10 0 10 s 0.020 0.040 0.51 1.01 case 64808 16pin dip plastic
89 package outline dimensions motorola smallsignal transistors, fets and diodes device data package outline dimensions (continued) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. a b g p 7 pl 14 8 7 1 m 0.25 (0.010) b m s b m 0.25 (0.010) a s t t f r x 45 seating plane d 14 pl k c j m dim min max min max inches millimeters a 8.55 8.75 0.337 0.344 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.228 0.244 r 0.25 0.50 0.010 0.019 case 751a03 so14 plastic notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 18 16 9 seating plane f j m r x 45 g 8 pl p b a m 0.25 (0.010) b s t d k c 16 pl s b m 0.25 (0.010) a s t dim min max min max inches millimeters a 9.80 10.00 0.386 0.393 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019 case 751b05 so16 plastic

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